▎ 摘　　要

NOVELTY - Thermal exchange assembly comprises: a cold plate configured to be placed on a semiconductor device (205), where the cold plate includes a window section (231); and a heat pipe (HP) (201) directly coupled to the cold plate, where the HP includes a window (301), the window is a recessed or depressed portion of the HP, and the window is disposed on the window section. The cold plate is formed of copper, a copper alloy, aluminum, or an aluminum alloy. The HP is formed from copper, a copper alloy, aluminum, an aluminum alloy epoxy-impregnated carbon fiber, or graphene. The step of coupling the HP to the cold plate comprises soldering the HP to the cold plate, and a solder alloy used for the soldering is based on chemical properties of the working fluid. USE - The thermal exchange assembly is useful in: a computing platform, where the computing platform is one of a desktop computer, a workstation, a laptop, a server, a network appliance, a mobile device, an internet of things device, network equipment, a medical device, a smart appliance, a tactile computing system, a satellite computing system, aviation systems, vehicular computing system, an industrial automation computing system, or a robot (all claimed); and heat transfer devices or heat exchangers for computing systems. ADVANTAGE - The thermal exchange assembly: has heat pipes for improved thermal performance at a cold plate interface; has cold plate that transfers the heat to the HP with less thermal resistance than existing HP solutions; increases the heat transfer area of the cold plate to HP vapor space without requiring relatively large amounts of working fluid and without increasing the surface area of the HP; creates cavity/window that increases the thermal transfer area (or thermal interface), which increases the area for evaporation and heat transfer, and increases the area/volume for working fluid storage, hence increases the capillary limit and reduces the likelihood of dryout; provides thermal improvement and HP thickness reduction; reduces the HP-cold plate junction thermal resistance and improves the power capabilities of various semiconductor devices, hence improves the cooling effect on electronic devices that can lead to improved computing performance, as compared to conventional HPs assembly designs; reduces the HP dryout risks because a reservoir of liquid at the HP evaporator is created; increases the lifespan of the HP, when compared with conventional HPs; provides structural improvements by reducing the overall height by the wall thickness of the HP, which can save space inside the computing system chassis; and improves the stiffness of the cold plate and allows thin bondline. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) fabricating a thermal exchange assembly; and (2) a computing platform. DESCRIPTION OF DRAWING(S) - The figure shows cross-section view of a heat pipe assembly with various window arrangements. Heat pipe (201) Attachment springs (204) Semiconductor device (205) Window section (231) Window (301)