▎ 摘　　要

NOVELTY - High heat-conducting polyimide film with good film-forming properties comprises 8-75 pts. wt. aromatic diamine monomer, 35-70 pts. wt. aromatic dianhydride monomers, 30-65 pts. wt. heat-conducting filler, 0.2-0.8 pts. wt. film-forming auxiliary materials and 400-800 pts. wt. polar solvents. USE - Used as high heat-conducting polyimide film with good film-forming properties. ADVANTAGE - The polyimide film has high thermal conductivity and excellent tensile strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the polyimide film, comprising mixing and dispersing heat-conducting fillers and film-forming auxiliary materials in polar solvent, performing ultrasonic treatment, adding aromatic diamine monomers, and stirring until all aromatic diamine monomers are dissolved to obtain mixed solution A, (2) adding aromatic dianhydride monomers to mixed solution A in the step (1), stirring, filtering, allowing to stand, and defoaming to obtain mixed solution B, and (3) adding the mixed solution B into the feeding hopper, using scraper to control the thickness of the film after extruding through the drooling extrusion die channel, drooling the mixed solution B on the steel strip to form film, heating at 100-105℃ to remove part of the solvent in the film, obtaining polyamic acid gel film with certain self-supporting property, performing thermal imidization, i.e. increasing the temperature according to gradient of 80℃/10 minutes, 180℃/60 minutes, 230℃/30 minutes and 390℃/60 minutes, and naturally cooling to obtain polyimide film after the imidization is completed.