▎ 摘　　要

NOVELTY - The structure has a circuit layer (112) comprising a set of pads. A dielectric layer (114) is provided on the circuit layer and comprises an opening (116) that exposes the pads. A graphene layer (120) is provided on the dielectric layer and in the opening, and comprises a conductive seed layer region (122) and a non-conductive seed layer region. A conductive via is provided in the opening. A build-up circuit layer is provided corresponding to the conductive seed layer region, where the build-up circuit layer exposes the non-conductive seed layer region and is electrically connected to the pads through the conductive via and the conductive seed layer region. USE - Circuit board structure. ADVANTAGE - The structure can effectively improve reliability of signal transmission or yield of a product. The structure prevents circuit undercut, circuit peel-off, or circuit shape deformation from happening to a seed layer covered by the build-up circuit layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a circuit board structure. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a circuit board structure. 112Circuit layer 114Dielectric layer 116Opening 120Graphene layer 122Conductive seed layer region