▎ 摘 要
NOVELTY - Semiconductor flexible refrigeration cloth comprises P-type semiconductor particles (11), N-type silicon carbide particles (12), metal caps (13), liquid metals (14) and flexible substrates (15). The P-type and N-type semiconductor particles are arranged in an interval. The adjacent P-type semiconductor particles and the N-type semiconductor particles are connected by the liquid metal. The connection point is arranged between the metal caps of the P semiconductor particle and the end surface of the N semiconductor nanoparticles. The flexible substrate is filled between the function layer and provides a support frame for supporting the liquid metals. The cloth further comprises a heat conducting layer (2) and a heat dissipating layer (3). USE - The cloth is useful in flexible thermoelectric device comprising but are not limited to organic electrons, plastic electrons, bioelectrons, nano-electrons and printed electronics e.g. radio frequency identification (RFID), flexible display, organic electroluminescent (OLED) display and illumination, chemical and biosensor, flexible photovoltaic, flexible logic and storage, flexible battery and wearable device. ADVANTAGE - The cloth: realizes the interconnection of the P-type semiconductor particles and the N-type semiconductor particles; improves the problem of the flexible problem of the device in the existing solution and the resistance fluctuation caused by the deformation of the interconnection layer; ensures refrigeration efficiency; and is set metal cap to obviously and reliably generate Peltier effect. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) preparing the semiconductor flexible refrigeration cloth; and (2) a flexible substrate injection mold. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the semiconductor flexible refrigeration cloth. Heat conducting layer (2) Heat dissipating layer (3) P-type semiconductor particles (11) N-type semiconductor particles (12) Metal cap (13) Liquid metal (14) Flexible substrate (15) Diffusion barrier layer (16)