▎ 摘　　要

NOVELTY - Thermal interface material (3) (M1) comprises a material comprising: fillers; and/or coated fillers, where the coating is graphene or boron nitride. USE - The thermal interface material is useful in a thermal interface composite or a composite structure, where thermal interface material is in the form of grease, gel, adhesive, paste, solder, pad or phase change material (all claimed). ADVANTAGE - The thermal interface material exhibits good through-plane thermal conductivity for thermal interface applications. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a thermal interface material (M2) comprising a filler coated with a thermally conductive material; (2) providing a thermal interface composite, comprising: providing a first substrate that is a heat sink (7); providing a second substrate that is a heat source; and placing the thermal interface material (M1) or (M2) between the first substrate and the second substrate; and (3) a composite structure comprising solid heat source, solid heat sink, and the thermal interface material (M1) or (M2) between the solid heat source and the solid heat sink. DESCRIPTION OF DRAWING(S) - The figure shows a thermal interface material showing a pad on AIN board, LED chip, thermal interface material, silicon, and heat sink. AIN board (1) LED chip (2) Thermal interface material (3) Silicon (4) Heat sink (7)