▎ 摘　　要

NOVELTY - Preparation of micro-light-emitting diode (LED) display panel involves providing first substrate having multiple thin film transistor installation areas and multiple micro-LED mounting areas, forming first through hole in each of micro-LED mounting areas of first substrate, depositing metal material on first substrate to form first metal layer, forming first heat-conducting portion in each of micro-LED mounting areas, depositing insulating material on first substrate to form gate electrode insulating layer, depositing semiconductor material on the gate electrode insulating layer to form semiconductor active layer, performing patterning process on semiconductor active layer to form semiconductor active unit, etching gate electrode insulating layer to form second through hole exposing the first heat-conducting portion, depositing metal material on gate electrode insulating layer to form second metal layer, and patterning second metal layer to form source electrode and drain electrode. USE - Preparation of micro-LED display panel (claimed) for glass picture tube display, liquid crystal display, organic light-emitting display, digital light processing and laser display. ADVANTAGE - The arrangements of first, second and third heat conducting portions are convenient for fast heat dissipation of micro-LED, which can effectively improve the radiating performance, so as to improve service life of the micro-LED display panel. The first adhesive layer only covers the micro-LED mounting area, to transfer the micro-LED to the first substrate, and the presence of the adhesive layer can improve the adhesion stability of the micro-LED by setting each of functional core area and peripheral auxiliary area. DETAILED DESCRIPTION - Preparation of micro-LED display panel involves providing first substrate having multiple thin film transistor installation areas and multiple micro-LED mounting areas, forming first through hole in each of micro-LED mounting areas of first substrate, depositing metal material on first substrate to form first metal layer, filling first through hole with first metal layer, patterning first metal layer to form metal gate electrode in each of the thin film transistor installation areas, forming first heat-conducting portion in each of micro-LED mounting areas, depositing insulating material on first substrate to form a gate electrode insulating layer, depositing semiconductor material on the gate electrode insulating layer to form a semiconductor active layer, performing patterning process on semiconductor active layer to form a semiconductor active unit in each of the thin film transistor installation areas, etching gate electrode insulating layer to form a second through hole exposing the first heat-conducting portion, depositing metal material on the gate electrode insulating layer to form a second metal layer, filling second through hole with second metal layer, patterning second metal layer to form source electrode and drain electrode in each of the thin film transistor installation areas, forming second heat-conducting portion in each of micro-LED mounting areas, where the second heat-conducting portion contacts first heat-conducting portion, depositing insulating material to form first insulating layer, where the first insulating layer covers the semiconductor active unit, source electrode, drain electrode and second heat-conducting portion, forming planarization layer on first insulating layer, forming third through hole exposing the second heat-conducting portion in first insulating layer and planarization layer, depositing metal material in third through hole to form third heat-conducting portion, where the third heat-conducting portion contacts second heat-conducting portion, forming first adhesive layer on planarization layer, where the first adhesive layer only covers micro-LED mounting areas, forming second conductive layer, semiconductor functional layer and transparent conductive layer on second substrate, forming multiple micro-LED by patterning, transferring micro-LED on second substrate to micro-LED mounting area of first substrate, so that the second conductive layer of each micro-LED is bonded to first adhesive layer, forming fourth through hole exposing drain electrode in the first insulating layer and planarization layer, depositing metal material to form third metal conductive layer, filling fourth through hole with third conductive metal layer, and electrically connecting drain electrode with second conductive layer.