▎ 摘　　要

NOVELTY - Heat dissipation film (100) comprises first heat dissipation layer comprising a thermally conductive material (121); second heat dissipation layer comprising a thermally conductive material; and flexible layer (130) positioned between the first heat dissipation layer and the second heat dissipation layer, where at least a portion of the first heat dissipation layer is located inside the flexible layer, and at least a portion of the second heat dissipation layer is inside the flexible layer. USE - The heat dissipation film is useful as cooling unit for electronic products e.g. smart phones, tablet PCs, and thin-film display products. ADVANTAGE - The heat dissipation film: has improved flexibility and performance; is durable. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for producing heat dissipation film, comprising (a) preparing a solid first heat dissipation layer in which a thermally conductive material and a hot melt resin (121) are mixed; (b) disposing a flexible layer on the first heat dissipation layer; (c) disposing a solid second heat dissipation layer in which a thermally conductive material and a hot melt resin are mixed on the flexible layer; and (d) pressing the first heat dissipation layer and the second heat dissipation layer at a high temperature of ≥ 140° C, so that at least a portion of the first heat dissipation layer and the second heat dissipation layer are located inside the flexible layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the heat dissipation film. 100Heat dissipation film 110Heat dissipation layer 121Thermally conductive materials 122Hot melt resin 130Flexible layer