▎ 摘　　要

NOVELTY - Preparation of omnidirectional thermosetting conductive adhesive involves using 10-20 Wt.% conductive particles, 0.5-1.5 wt.% graphene, 20-35 wt.% epoxy resin, 5-12 wt.% ethylene-vinyl acetate hot melt adhesive, 0.5-1 wt.% anti-settling agent, 0.2-0.5 wt.% antioxidant, 30-50 wt.% diluent, 2-4 wt.% latent curing agent and 0-1 wt.% curing accelerator. USE - Preparation of omnidirectional thermosetting conductive adhesive (claimed). ADVANTAGE - The method efficiently and economically provides omnidirectional thermosetting conductive adhesive having excellent bonding strength, conductivity and compatibility, by simple method. DETAILED DESCRIPTION - Preparation of omnidirectional thermosetting conductive adhesive involves mixing 10-20 Wt.% conductive particles, 0.5-1.5 wt.% graphene, 20-35 wt.% epoxy resin, 5-12 wt.% ethylene-vinyl acetate hot melt adhesive, 0.5-1 wt.% anti-settling agent, 0.2-0.5 wt.% antioxidant and 30-50 wt.% diluent, stirring uniformly, obtaining mixture (A), adding mixture (A) to three-roll machine for grinding, adding 2-4 wt.% latent curing agent and 0-1 wt.% curing accelerator, stirring uniformly, obtaining mixture (B), grinding the mixture (B) using three-roll machine, controlling the temperature at less than 35 degrees C, vacuum defoaming, obtaining conductive glue liquid, applying conductive glue to PET transparent release film, control the drying temperature at 90-100 degrees C in the coating speed of 8-12 m/minute, and drying the thickness of 30-60 microns.