• 专利标题:   Manufacturing graphene film comprises annealing first substrate in furnace filled with mixed gas, moving substrate into growing chamber of molecular beam epitaxy system, heating carbon source and depositing it on surface of substrate.
  • 专利号:   US2014273414-A1, TW201434744-A, US9029190-B2, TW503276-B1
  • 发明人:   LIN S, LIN M, LIN S Y, LIN M Y
  • 专利权人:   ACAD SINICA, ACAD SINICA, ACAD SINICA
  • 国际专利分类:   H01L021/02, C01B031/04, H01L021/335, H01L021/00, H01L029/16, H01L029/66, H01L029/778
  • 专利详细信息:   US2014273414-A1 18 Sep 2014 H01L-021/02 201469 Pages: 11 English
  • 申请详细信息:   US2014273414-A1 US028760 17 Sep 2013
  • 优先权号:   TW108797

▎ 摘  要

NOVELTY - Manufacturing a graphene film, comprises: (a) annealing a first substrate in a furnace filled with a mixed gas; (b) moving the first substrate into a growing chamber of a molecular beam epitaxy system, where a temperature of the growing chamber is room temperature to 500 degrees C; (c) heating a carbon source set in the molecular beam epitaxy system to evaporate carbon atoms onto a surface of the first substrate; and (d) depositing the carbon atoms on the surface of the first substrate to grow the graphene film. USE - The method is useful for manufacturing a graphene film and a graphene channel within a transistor, where the transistor is a back-gate transistor (claimed). ADVANTAGE - The method provides graphene channel within a transistor under low temperature and having excellent current modulation characteristics. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing a graphene channel within a transistor, comprising (a)-(d) as above per se, (e) replacing the first substrate with a second substrate, and (f) etching the graphene film by a photolithography process.