▎ 摘　　要

NOVELTY - A special LED lamp packaging material comprises 20-40 pts. wt., preferably 30 pts. wt. organosilicone-modified epoxy resin, 20-50 pts. wt., preferably 35 pts. wt. high-methyl phenylvinyl silicone resin, 10-20 pts. wt., preferably 15 pts. wt. graphene oxide, 5-15 pts. wt., preferably 10 pts. wt. methylphenyldichlorosilane, 3-10 pts. wt., preferably 7 pts. wt. silica, 5-10 pts. wt., preferably 8 pts. wt. 2,6-di-t-butyl-4-methylphenol, and 2-8 pts. wt., preferably 5 pts. wt. butylhydroxyanisole. USE - Special LED lamp packaging material (claimed). ADVANTAGE - The special LED lamp packaging material can be prepared by a simple method, and has excellent aging resistance, compression resistance, hardness, and oxidation resistance, and prolongs the service life of LED lamps. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of special LED lamp packaging material, which involves heat-dissolving organosilicone-modified epoxy resin and high-methyl phenylvinyl silicone resin, stirring, adding graphene oxide, methylphenyldichlorosilane, and silica, stirring at 1000-2000 rpm for 5-10 minutes, leaving still for 10 minutes, adding remaining components, mixing, defoaming, curing in a mold at 160-170 degrees C, and cooling to room temperature.