▎ 摘　　要

NOVELTY - Dicing tape comprises a conductive base film (110); and an adhesive layer (120) formed on one surface of the base film and attached to the rear surface of a semiconductor wafer (200). The base film includes carbon nanotubes and/or graphene. USE - The dicing tape is useful for fixing semiconductor wafer. ADVANTAGE - The dicing tape prevents static electricity defects in manufacturing semiconductor chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for producing dicing tape comprising (a) preparing a polyimide solvent, (b) dispersing carbon nanotubes or graphene hybrids in dimethylacetamide solvent to form a first mixed solution, (c) forming a second mixed solution by mixing the polyimide solvent and the first mixed solution, and (d) casting the second mixed solution on a support, drying, peeling and then curing. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the semiconductor wafer mounted on dicing tape. Conductive base film (110) Adhesive layer (120) Semiconductor wafer (200)