▎ 摘　　要

NOVELTY - Preparation of high-thermal-conductivity 3-3 type graphene/epoxy resin composite material involves (S1) mixing 2-5 mg/mL graphene oxide aqueous solution with ascorbic acid, reducing at specific temperature to obtain graphene hydrogel, (S2) soaking in deionized water to remove original solvent and other impurities, (S3) freezing and solidifying the hydrogel, (S4) carrying out vacuum freeze drying for 24-72 hours to obtain graphene aerogel, (S5) pre-reducing at 600-1000℃ for 0.5-1.5 hours under argon protection, reducing at 2300-3300℃ for 0.5-1.5 hours, (S6) cutting off upper bottom surface and lower bottom surface of the aerogel to expose internal pore structure, soaking in a mixed solution of epoxy resin and curing agent, vacuumizing at 70-90℃ for 0.5-1.5 hours, (S7) pre-curing at 110-130℃ for 1.5-2.5 hours, curing at 140-160℃ for 14-16 hours, and (S8) cooling to room temperature. USE - Preparation of high-thermal-conductivity 3-3 type graphene/epoxy resin composite material used as electronic packaging material (all claimed) used in electronic devices. ADVANTAGE - The method effectively improves the thermal conductivity of the graphene/epoxy resin composite material, and overcomes the problem of low thermal conductivity caused by excessive graphene/epoxy resin interface, constructs graphene three-dimensional thermal conduction path in epoxy resin matrix, and restore the structure and thermal conductivity of graphene through high-temperature reduction treatment.