▎ 摘　　要

NOVELTY - Resin composition comprises (a) 100 pts. wt. epoxy resin, 2-100 pts. wt. epoxy curing agent, 0.05-1 pts. wt. curing accelerator, 1-10 wt.% carboxylated nitrile rubber of epoxy resin, epoxy curing agent and curing accelerator, (e) 5-40 wt.% carbodiimide compound of carboxylated nitrile rubber; preparing resin composition comprising (i) mixing dissolved epoxy resin, epoxy resin curing agent, carboxylated nitrile rubber, carbodiimide compounds in proportion to obtain resin mixture, (ii) pre-reacting resin mixture at temperature of 30-70℃ for 2-48 hours to obtain pre-reactant and (iii) adding dissolved component curing accelerator to pre-reactant, stirring and mixing evenly to obtain resin composition. USE - The resin composition is useful for preparing low-flow adhesive prepreg in rigid-flex printed circuit board (all claimed). ADVANTAGE - The resin composition: improves bonding force and apparent flatness of low-flow glue prepreg. The low-flow glue prepreg: has excellent toughness and low powder removal rate, heat resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing low-flow adhesive prepreg comprising dissolving resin composition in solvent to form glue, and impregnating reinforcing material in glue, heating impregnating reinforcing material and drying.