• 专利标题:   Method for forming thin film assembly of film-shaped object, such as semiconductor wafer, involves reducing thickness of film to obtain thin film, and stretching membrane using stretching frame to obtain extended membrane.
  • 专利号:   CN115016226-A, US2022365421-A1, TW202244593-A
  • 发明人:   LIN J, GAO C, CHEN L, LIAN D, XU B, LI X, LIN C, GAU T, LIEN T, HSU P, LEE H
  • 专利权人:   TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MFG CO LTD
  • 国际专利分类:   G03F001/22, G03F001/62, G03F001/64, H01L021/033
  • 专利详细信息:   CN115016226-A 06 Sep 2022 G03F-001/62 202276 Chinese
  • 申请详细信息:   CN115016226-A CN10820401 20 Jul 2021
  • 优先权号:   US318315

▎ 摘  要

NOVELTY - The method involves reducing a thickness of a film to obtain a thin film. The film membrane is fixed to a mounting frame to obtain the film assembly. A pressure is applied to the film to obtain the thin film. The membrane is stretched using a stretching frame to obtain an extended membrane. The mounting frame is secured to a portion of the extended membrane. The mounting frame and the portion of the extended membrane are separated from the remainder of the extended membrane to obtain the film assembly. The membrane comprises nanotubes, graphene or graphite. USE - Method for forming a thin film assembly of a film-shaped object, such as semiconductor wafer. ADVANTAGE - The thin film membrane can be formed from nanotubes and have a combination of high transmission, low deflection, and small pore size. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of forming a reticle assembly. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram of method for forming a thin film assembly of a film-shaped object. (Drawing includes non-English language text).