▎ 摘　　要

NOVELTY - Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with a surface of a polyetherimide substrate for a first dwell time to form a pre-etched polyetherimide substrate, and contacting pre-etched polyetherimide substrate with a mixture of sulfuric acid and periodate ions for a second dwell time to form an oxidized polyetherimide surface. The oxidized polyetherimide surface is contacted with an alkaline metal hydroxide solution for a third dwell time without rinsing between the applying steps or between the applying and contacting steps. The polyetherimide comprises a low volume percentage of reinforcement particles, and process does not include contacting the polyetherimide substrate with nitric acid in the step. USE - Method for enhancing surface adhesion of polyetherimide for metal plating.