• 专利标题:   Preparing insulating heat-conducting gasket used in electronic application, involves mixing raw materials containing heat-conducting filler and polymer matrix material, placing obtained slurry in centrifuge cylinder, heating and curing.
  • 专利号:   CN114213849-A
  • 发明人:   CHI K, SUN Q, CUI W
  • 专利权人:   FOSHAN SOUTHERN CHINA NEW MATERIALS INST
  • 国际专利分类:   C08J003/205, C08J005/18, C08K007/06, C08K007/18, C08K009/06, C08L083/05, C08L083/07
  • 专利详细信息:   CN114213849-A 22 Mar 2022 C08L-083/07 202277 Chinese
  • 申请详细信息:   CN114213849-A CN11488204 07 Dec 2021
  • 优先权号:   CN11488204

▎ 摘  要

NOVELTY - Method for preparing insulating heat-conducting gasket, involves (a) uniformly mixing raw materials containing heat-conducting filler and polymer matrix material to obtain slurry, and (b) placing obtained slurry in centrifuge cylinder, where the slurry is dispersed along the barrel wall of the centrifuge cylinder for centrifugation, and heating and curing to obtain insulating heat conduction gasket. USE - Method for preparing insulating heat-conducting gasket (claimed) used in electronic applications. ADVANTAGE - The method solves the problems of slow heat dissipation, low work efficiency and short service life in electronic equipment, and the gasket has excellent insulation performance and does not cause the electronic equipment to conduct electricity.