▎ 摘　　要

NOVELTY - Heat-conducting adhesive comprises 10-50 pts. wt. graphite powder or graphene powder, 10-50 pts. wt. epoxy resin and 5-30 pts. wt. nano silicon dioxide. USE - The adhesive is useful as cooling components in electronics and light emitting diode devices (claimed). ADVANTAGE - The adhesive has excellent heat conducting and radiating performance while ensuring radiating substrate firmly with adhesive force, and radiating performance on XYZ shaft. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) increasing conductivity in XYZ axis direction of heat conductive adhesive comprising integrating heat-conducting adhesive and the graphite film to obtain heat-conducting film; (2) heat-conducting film, where the heat-conducting film are integrally comprising a conformable graphite film and heat-conducting adhesive, the heat-conducting adhesive is dispersed with graphite powder and/or graphite powder; and (3) preparing heat-conducting film comprising (i) dispersing graphite powder and/or graphene powder in adhesive solution to obtain heat-conducting adhesive glue, and (ii) coating the solution obtained in step (i) on graphite film, and then drying to obtain final product.