• 专利标题:   Wiring structure for use in electronic device e.g. memory device, has nanocrystalline graphene layer which is provided on substantial entirety of conductive material layer, seed layer is provided on another conductive material layer.
  • 专利号:   US2020350256-A1
  • 发明人:   LEE C, SHIN H, PARK S, IM D, PARK H, SHIN K, LEE J, LIM H
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   H01L023/532
  • 专利详细信息:   US2020350256-A1 05 Nov 2020 H01L-023/532 202094 Pages: 21 English
  • 申请详细信息:   US2020350256-A1 US933544 20 Jul 2020
  • 优先权号:   KR019211, KR149331

▎ 摘  要

NOVELTY - The wiring structure (20) has a first conductive material layer. A nanocrystalline graphene (50) layer is provided on a substantial entirety of the first conductive material layer. A seed layer is provided on the first conductive material layer. The nanocrystalline graphene layer is directly grown on the seed layer. The nanocrystalline graphene layer has a ratio of 2D/G of a Raman spectrum which is equal to or greater than 0.05, and a ratio of D/G that is equal to or less than 2. USE - Wiring structure for use in electronic device e.g. memory device. ADVANTAGE - A specific resistance of a wiring structure is reduced by inserting graphene between actual wiring structures of the multi-stack structure. The nanocrystalline graphene has a lot of sites to which a dopant is bonded, and thus a doping effect is greatly increased. The wiring structure has a high adhesive strength to a surface of a metal and has a reduced resistance of a wiring is realized. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic cross-sectional view of a wiring structure. Wiring structure (20) Conductive material layer (30) Nanocrystalline graphene (50) Graphene layer (70)