▎ 摘　　要

NOVELTY - The semiconductor device assembly has a substrate (214), a semiconductor device (212) over the substrate, and a thermal connector (234) between and directly contacting opposing surfaces of the substrate and the semiconductor device. The thermal connector transfers thermal energy between the substrate and the semiconductor device. The substrates include a graphene layer thermally coupled to the thermal connector and configured to transfer the thermal energy along a horizontal direction across the substrate. USE - Semiconductor assembly for semiconductor module (claimed). ADVANTAGE - Reduces physical stress, impact, bend on the thermal layers that may be caused by external forces. Provides a compression-fit or a lock between the intermediate layer and the graphene layer. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a semiconductor module; and (2) a method of manufacturing a semiconductor package. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic cross-sectional view of the semiconductor device assembly. Assembly structure (202) Semiconductor modules (204) Semiconductor device (212) Substrate (214) Device thermal layer (222) Thermal connector (234)