• 专利标题:   Hybrid super-surface biosensor for detecting non-labeled biological protein, is prepared by using ultra-thin flexible polyimide film as substrate, and periodically arranging sub-wavelength metal grating structure on surface of substrate.
  • 专利号:   CN114199828-A
  • 发明人:   DAI G, LIU W, LEI J, XU L, XU J, SHEN Y
  • 专利权人:   UNIV NANCHANG
  • 国际专利分类:   G01N021/552
  • 专利详细信息:   CN114199828-A 18 Mar 2022 G01N-021/552 202255 Chinese
  • 申请详细信息:   CN114199828-A CN11492145 08 Dec 2021
  • 优先权号:   CN11492145

▎ 摘  要

NOVELTY - The biosensor is prepared by using ultra-thin flexible polyimide (PI) film as a substrate; periodically arranging sub-wavelength metal grating structure on the surface of the substrate, period p and gap w respectively 178 microns and 42 microns; depositing an alumina film of about 30 nm thick on a surface of a metal strip, and paving a layer of single-layer graphene above the alumina thin layer opposite to the structure. USE - Metal-graphene hybrid super-surface biosensor for detecting a non-labelled biological protein. ADVANTAGE - The biosensor ensures low preparation cost, good ductility, and detection of the biological protein containing electron with high sensitivity and specificity conveniently. The graphene contains off-domain electron, which improves the adsorption efficiency of the analyte, and the Fermi level of p-type doped graphene is directed to Dilax point so as to realize high-sensitivity specificity detection for substance containing pi electron. The metal-graphene hybrid super-surface biosensor of Rabi splitting based on strong coupling effect, uses ultra-thin flexible polyimide film as substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method based on metal-graphene hybrid super-surface biosensor, which involves: (1) using polydimethylsiloxane (PDMS) thermosetting, the 50 m thick flexible PI film is combined on the surface of the flat silicon sheet; (2) using electron beam evaporation coating system, plating metal copper with thickness of 100-300nm on the surface of the PI film; (3) PI film after copper plating by a spin coater, uniformly spin coating a layer of positive photoresist of 0.7-3.0 m thick, using laser direct writing system for exposure and development; (4) etching the developed structure by reactive ion etching technology; (5) depositing aluminium oxide film of about 30 nm thick on the surface of the metal strip by using the atomic layer deposition technology; (6) peeling off the structure from the silicon chip and adhering on the hollow poly(ethylene terephthalate) (PET) film with the thickness of 100-100 microns to fix the PI; (7) transferring the graphene film to the surface of alumina by wet transfer; and (8) in the process of using graphene, the graphene and the metal grating area are overlapped up and down, then dissolving the poly(methyl methacrylate) (PMMA) coating supporting graphene by acetone for three times. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of a super surface biosensor structure preparation method. (Drawing includes non-English language text).