▎ 摘　　要

NOVELTY - Resin composition comprises a molded portion having electromagnetic wave absorber, where the imaginary part ( epsilon '') of complex dielectric constant at 25 degrees C and 10 GHz and volume resistivity ( rho v) at 25 degrees C satisfies the relation that (log rho v) x epsilon '' is greater than 20 and less than 600, and the imaginary portion ( epsilon '') is greater than 1.25. USE - The resin composition is useful in electronic component (claimed) for communication, and used in module-type electronic component packages and for packaging electronic components on large-format substrate, such as fan out wafer level package. ADVANTAGE - The resin composition electronic component has electromagnetic wave absorbing function in high frequency band, increased direct current resistance, and ensures improved electromagnetic wave absorption performance in high frequency band and excellent electrical insulation performance.