▎ 摘　　要

NOVELTY - A heat-dissipating paint composition comprises 30-60 wt.% binder resin, 10-25 wt.% thermally conductive particles, 5-15 wt.% additives, and 10-50 wt.% solvent. The binder resin comprises a urethane resin or an epoxy resin. The thermally conductive particles comprise expanded graphite particles and metal particles. The expanded graphite particles are milled for 2-6 hours to exfoliate a portion of the expanded graphite particles to be separated into graphene nanoplates (GNPs) and graphene. The diameter of the expanded graphite particles is 0.1-50 μ m. The additive comprises an anti-settling agent. The anti-settling agent is a urea-based compound. USE - Composition used in production of heat-dissipating paint for forming heat-dissipating coating film for heat sink (all claimed) for high performance of electronic product e.g. organic light-emitting diode display and personal computer, semiconductor chips, and printed circuit board. ADVANTAGE - The heat-dissipating paint composition has excellent heat radiation characteristics, adhesiveness, hardness, durability, thermal conductivity, thermal shock resistance, and prevents peeling from the surface of the heat-dissipating component during use. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: production of heat-dissipating paint, which involves milling the composition to prepare a dispersion, and adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion; and a heat-dissipating coating film, which is formed by applying the heat-dissipating coating composition on a substrate and baking at 70-100° C.