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  • 专利标题:   Semi-flexible component carrier e.g. semi-flexible printed circuit board (PCB) has electrically insulating layer structure which forms portion of semi-flexible section in which material with elongation of greater than specific value.
  • 专利号:   DE102020120638-A1, CN112349676-A, US2021045235-A1, US11284508-B2, CN112349676-B, US2022159828-A1
  • 发明人:   XIN N, TUOMINEN M, TAY S K, XIN L, ZHENG X
  • 专利权人:   AT S AUSTRIA TECHNOLOGIE SYSTEMTECHN, AT S AUSTRIA TECHNOLOGIES SYSTEM TEC, AT S AUSTRIA TECHNOLOGIE SYSTE, AT S AUSTRIA TECHNOLOGIES SYSTEM TEC, AT S AUSTRIA TECHNOLOGIES SYSTEMTEC
  • 国际专利分类:   H05K001/02, H05K001/03, H05K003/00, H01L021/48, H01L023/14, H01L023/498, H05K001/18, H05K003/46
  • 专利详细信息:   DE102020120638-A1 11 Feb 2021 H05K-001/02 202117 Pages: 22 German
  • 申请详细信息:   DE102020120638-A1 DE10120638 05 Aug 2020
  • 优先权号:   CN10721769

▎ 摘　　要

NOVELTY - The component carrier (100) has a laminated stack (102) that is provided with one electrically insulating layer structure (106) and one electrically conductive layer structure (104). The stack is comprised of rigid section (108) and defines a semi-flexible section (110). The electrically insulating layer structure is set to form a portion of the semi-flexible section, is provided with a material with an elongation of greater than 3% and Youngs modulus of less than 5 GPa. The semi-flexible section is provided with epoxy resin selected from reinforced or unreinforced resin, bismaleimide-triazine resin, FR-4, FR-5, cyanate ester , Polyphenylene derivative, glass, prepreg material, and epoxy-based build-up layer. The electrically insulating layer structure is set to form a portion of the semi-flexible sections free from glass fiber fabric. The electrically conductive layer structure is comprised of copper, aluminum, nickel, silver, gold, palladium and tungsten, and coated with graphene. USE - Semi-flexible component carrier such as semi-flexible printed circuit board (PCB). ADVANTAGE - The rigid and partially flexible component carrier is provided with high reliability. The semi-flexible section can be produced from material with a low Young's modulus and high extensibility, and can be very advantageous to provide both the outermost and the central dielectric layer structure from a material with a low Young's modulus and high ductility. The high homogeneity and high mechanical robustness of the component carrier are ensured. The homogeneity of the semi-flexible section and the connected areas of the one or more rigid sections is further improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for producing semi-flexible component carrier. DESCRIPTION OF DRAWING(S) - The drawings show the schematic views of the semi-flexible component carrier. Semi-flexible component carrier (100) Laminated stack (102) Electrically conductive layer structure (104) Electrically insulating layer structure (106) Rigid section (108) Semi-flexible section (110)