▎ 摘　　要

NOVELTY - An integrated heat sink comprises a unitary graphene material article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member. The heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the heat dissipation member. The unitary graphene material is obtained from heat-treating a graphene oxide gel at a heat treatment temperature higher than 100 degrees C and contains chemically bonded graphene molecules or chemically merged graphene planes. USE - As integrated heat sink used in electronic device (claimed) such as central processing unit, camera unit, battery, supercapacitor, and electric power supply that generates heat when the device is in operation. ADVANTAGE - The integrated heat sink comprising unitary graphene material that has an electrical conductivity greater than 3000 S/cm, preferably greater than 5000 S/cm, especially greater than 15000 S/cm; a thermal conductivity greater than 600 W/mK, preferably greater than 1000 W/mK, especially greater than 1500 W/mK; a physical density greater than 1.8 g/cm3, preferably greater than 1.9 g/cm3, especially greater than 2 g/cm3; and a tensile strength greater than 40 MPa, preferably greater than 60 MPa, especially greater than 100 MPa; and exhibits high mechanical strength, good surface scratch resistance, and good hardness. DETAILED DESCRIPTION - An integrated heat sink comprises a unitary graphene material article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member. The heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the heat dissipation member. The unitary graphene material is obtained from heat-treating a graphene oxide gel at a heat treatment temperature higher than 100 degrees C and contains chemically bonded graphene molecules or chemically merged graphene planes having an inter-graphene spacing not greater than 0.40 nm. An INDEPENDENT CLAIM is included for an electronic device containing the integrated heat sink.