▎ 摘　　要

NOVELTY - The heat conducting structure (10) comprises a graphite structure formed by stacking multiple graphene sheets, a recess formed on the surface of the graphite structure on the side, where the heat transfer target is attached. The recess includes an inclined surface intersecting the surface. The covering portion is formed on the inclined surface for covering the edge portion of the graphene sheet in contact with the edge portion of the graphene sheet that appears on the inclined surface. USE - Heat conducting structure used in heat diffusion device for diffusing heat transferred from heat transfer object (claimed). ADVANTAGE - The heat conducting structure enables to maintaining high heat conductivity in the extending direction of a graphene sheet without lowering the strength. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic perspective view of the heat conducting structure. Heat conducting structure (10) Upper surface (10A) Coating layer (20) Concave portion (30) Semiconductor element (56)