• 专利标题:   Self-healing and damage-in-situ recognition epoxy resin composite material useful for functional epoxy resin composite material, comprises epoxy resin matrix, curing agent, microcapsules loaded with epoxy resin repairing agent, and microcapsules loaded with thiol repairing agent.
  • 专利号:   CN115304884-A
  • 发明人:   BAI Y, HUANG Y, LIU L, LI J, WANG B, SHEN Y, YUAN W, HU Z
  • 专利权人:   HARBIN INST TECHNOLOGY
  • 国际专利分类:   C08G059/66, C08K007/06, C08K007/26, C08K009/12, C08L063/00, G06T005/00, G06T007/00, G06T007/50
  • 专利详细信息:   CN115304884-A 08 Nov 2022 C08L-063/00 202303 Chinese
  • 申请详细信息:   CN115304884-A CN10969580 12 Aug 2022
  • 优先权号:   CN10969580

▎ 摘  要

NOVELTY - Self-healing and damage-in-situ recognition epoxy resin composite material comprises epoxy resin matrix, curing agent, microcapsules loaded with epoxy resin repairing agent, and microcapsules loaded with thiol repairing agent; the mass ratio of microcapsules loaded with epoxy resin repairing agent to the microcapsules loaded with thiol repairing agent is 1:0.5-1.5; the mass of the two as whole accounts for 1-50 wt.% of composite material. USE - The composite material is useful for functional epoxy resin composite material that realizes fusion of efficient damage spontaneous repair and damage synchronous in-situ real-time monitoring. ADVANTAGE - The composite material: has light weight, high specific strength, low thermal expansion coefficient, and excellent impact resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: preparing a self-healing and damage-in-situ recognition epoxy resin composite material comprising evenly mixing microcapsules into epoxy resin, cross-linking with the epoxy resin curing agent through room temperature or heat curing to generate a functional thermosetting epoxy resin; where, the content of the microcapsules is 1-50 wt.% weight of epoxy resin, weight ratio of the epoxy resin to the curing agent is 0.1-10:1, the curing reaction temperature is 0-120°C, and the curing time is 1 hours - 7 days. Infrared damage synchronous in-situ real-time monitoring system for functional thermosetting epoxy resin and epoxy resin composite materials with fusion of efficient damage spontaneous repair and damage synchronous in-situ real-time monitoring function, comprising computer, thermal image acquisition system, application software, and a thermal signal acquisition and reconstruction processing system; the computer is a hardware control platform, is connected to the thermal image acquisition system through an image transmission line, and provides a visual operation interface; the thermal image acquisition system is used to complete the recording of changes in the temperature field of the detected surface; the thermal image acquisition system mainly includes an infrared thermal imager and a front-end display, the infrared thermal imager is connected to the computer through the image transmission line, the infrared thermal imager is connected to the front-end display through a video transmission line; the infrared thermal imager is responsible for the real-time collection of infrared information on the surface of the epoxy resin composite material; the application software is used to control the detection process and analyze the detection results and output the collected information pixel by pixel, mainly including a serial port communication module, infrared camera control module, image acquisition module and data processing module; the serial port communication module is used for signal transmission between the infrared camera and the computer; the infrared camera control module is used for the adjustment and control of the infrared camera; the image acquisition module is used to collect infrared signals on the surface of the material and convert them into infrared grayscale images; the data processing module is used to process infrared thermal images e.g. filtering and differentiation; the acquisition thermal signal reconstruction processing system is composed of two parts: ''shrinkage-expansion'' processing and positioning analysis module; the ''shrinkage-expansion'' processing is to process the thermal signal collected by the thermal image acquisition system through algorithm design to make the boundaries clear, so that the originally blurred boundary at the damage boundary in the infrared grayscale image is clearer and easier to identify; the positioning analysis module is used for quantitative analysis of detection results, including functions e.g. damage area measurement, burial depth calculation, temperature-time curve and detection report.