• 专利标题:   Manufacturing field effect transducer for sensing assemblies involves providing field effect transducer base structure, comprising substrate, drain, and source, providing channel layer on field effect transducer base structure, and providing first layer comprising hexagonal boron nitride.
  • 专利号:   US2022384604-A1
  • 发明人:   BAKSHI S, AZIZE M
  • 专利权人:   ANALOG DEVICES INC
  • 国际专利分类:   H01L029/423, H01L029/66
  • 专利详细信息:   US2022384604-A1 01 Dec 2022 H01L-029/66 202298 English
  • 申请详细信息:   US2022384604-A1 US827619 27 May 2022
  • 优先权号:   US195104P, US827619

▎ 摘  要

NOVELTY - The method involves providing a field effect transducer (FET) base structure, comprising a substrate, a drain, and a source; providing a channel layer on the FET base structure; and providing a first layer on the FET base structure. The first layer comprises a one-dimensional or two-dimensional material and is arranged on an upper surface of the channel layer to form a sensing surface of the FET. The channel layer is formed and subsequently transferred onto the FET base structure. The first layer is formed on the FET base structure. USE - Method for manufacturing a field effect transducer (FET) for sensing assemblies. ADVANTAGE - The method enables to develop improved field effect transducer having high sensitivity, improved sensing capabilities, and can be miniaturised and manufactured on larger scales.