▎ 摘　　要

NOVELTY - The radiator has a heat pipe (2) whose middle portion is fixed in a lower cavity (13) of a shell (1). A graphene heat sink (8) adopts a SMT-035 graphene copper foil composed of 15-35 m graphene and 35-50 m copper foil. A surface of the graphene heat sink is adhered on a bottom surface of shell. A chip (4) is attached on another surface of graphene heat water sink. The lower cavity is filled with liquid metal (6). The liquid metal is bismuth-based alloy, gallium alloy or indium alloy. The heat pipe is provided with an L-type heat pipe. The distance from a horizontal section of the heat pipe to the bottom of the lower cavity of the shell is two fifths of the height of the low cavity. An outer side of the vertical section of heat pipe are provided with a fin (3) and filled with water (5). USE - Chip radiator of composite liquid metal and heat pipe for use in electronic industry and semiconductor industry. Can also be used in wind cooling and heat pipes radiator. ADVANTAGE - The chip is capable of quickly balancing the surface temperature of the chip, efficiently absorbing the heat generated when chip is working, and transmitting the heat to the external environment. The heat pipe has small internal thermal resistance, excellent heat conducting ability, compared with copper, aluminum and other metal, the heat pipe unit weight can transfer multiple orders of magnitude of heat. The liquid metal and heat pipe composite radiating are directly contacted the liquid metal phase change is liquid and has excellent flow performance, effectively reduces the heat resistance contact the heat of liquid metal absorption is quickly transmitted to heat pipe. DESCRIPTION OF DRAWING(S) - The drawing shows a side sectional view of the structure of chip radiator of composite liquid metal and heat pipe. Heat pipe (2) Fin (3) Chip (4) Water (5) Liquid metal (6) Heat conducting silicone grease (7) Graphene heat sink (8) Foam metal layer (9) Bipolar strong magnet (10) Motor (11) Lower cavity (13) Upper cavity (14)