▎ 摘　　要

NOVELTY - Chip bonding wiring connection structure comprises a substrate (1), a connecting foil (2) and a bonding wire (3). The material of the connecting foil and the bonding wire are made of one of graphene copper carbon alloy or copper-carbon-molybdenum alloy. The connecting foil and the bonding wire are processed by anti-oxidation treatment. The structure further comprises a connecting mechanism comprising clamping groove opened on the side wall of the connecting foil. USE - Used as chip bonding wire connecting structure. ADVANTAGE - The structure: makes the connection between the bonding wire and the connecting foil more firm; and greatly improves thermal conductivity, breaking strength, elongation and toughness compared with the traditional pure copper wire. DESCRIPTION OF DRAWING(S) - The drawing shows an integral connection diagram of the chip bonding wire connecting structure. Substrate (1) Connecting foil (2) Bonding wire (3)