• 专利标题:   Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.
  • 专利号:   US2023117153-A1, KR2023054171-A
  • 发明人:   CHU K, LEE J, JUNGHOON L, CHU K M
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   B23K035/02, B23K035/26, B23K035/36, B23K035/368, B23K035/24, C22C013/02, C23C018/16, C25D007/00
  • 专利详细信息:   US2023117153-A1 20 Apr 2023 B23K-035/02 202336 English
  • 申请详细信息:   US2023117153-A1 US965197 13 Oct 2022
  • 优先权号:   KR137839

▎ 摘  要

NOVELTY - Metal particle comprises a core including metal, and a shell on a surface of the core, where the shell comprises metal and nanoparticles. The metal particle is a transient liquid phase particle, and the metal of the core has a higher melting point than a melting point of the at least one metal of the shell. USE - Metal particles used in adhesive paste or solder paste for composite bonding structure for a semiconductor device (all claimed) such as flexible display device. ADVANTAGE - The metal particle has improved mechanical properties while enabling low-temperature mounting, and/or a method of preparing the metal particle for adhesive paste. The metal particle is capable of mounting semiconductor devices on printed circuit boards at low temperature, and thus may reduce defects and performance decline caused by thermal damage to semiconductor modules. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a composite bonding structure (100), which comprises a solder ball (110), and a heat-treatment product (130) of the solder paste attached to the solder ball; (2) a semiconductor device (200), which comprises a printed circuit board (210), a semiconductor chip (230), and the composite bonding structure between the printed circuit board and the semiconductor chip; (3) a method for preparing a metal particle for adhesive paste, which involves preparing a mixture containing a core-forming metal particle or a core-forming metal precursor, and a shell-forming metal precursor, and obtaining a composition by adding nanoparticles to the mixture, and contacting the composition; and (4) a composite structure, which comprises a core structure including metal, and shell structure surrounding the structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the composite bonding structure. 100Composite bonding structure 110Solder ball 130Heat-treatment product 200Semiconductor device 210Printed circuit board 230Semiconductor chip