▎ 摘　　要

NOVELTY - Thermally conductive polyimide film comprises 200-400 parts mass imide compounds of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 150-180 parts mass PTFE, 15-20 parts mass nanocellulose, 10-15 parts mass polyester resin, 5-10 parts mass graphene, 20-30 parts mass p-phenylenediamine, 10-15 parts mass diphenylbutanedione, 15-20 parts mass dipentaerythritol, 20-30 parts mass potassium tetraborate and 50-70 parts mass polypropylene. USE - As thermally conductive polyimide film. ADVANTAGE - The production process of the polyimide film has simple production steps. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a process for producing the thermally conductive polyimide film, which involves (i) taking imide compounds of polyamic acid, PTFE, nanocellulose, polyester resin, graphene, p-phenylenediamine, diphenylbutanedione, dipentaerythritol, potassium tetraborate and polypropylene, (ii) placing imide compounds of polyamic acid to a reaction kettle, adding dipentaerythritol, stirring and mixing, and heating and dehydrating, (iii) adding PTFE, nanocellulose, polyester resin, graphene, p-phenylenediamine and diphenylbutanedione, potassium tetraborate and polypropylene to the reaction kettle and continuously stirring and uniformly mixing to obtain a slurry, and (iv) casting and heating the slurry to form a film, and washing.