• 专利标题:   Integration method of graphene high-k gate dielectric layer used for semiconductor device, involves dissolving metal alkoxide in solvent, coating alkoxide solution on graphene surface and carrying out atomic layer deposition process.
  • 专利号:   CN102945801-A, CN102945801-B
  • 发明人:   CHEN G, LIU R, QIU Z, LU B, ZHANG Y
  • 专利权人:   UNIV FUDAN
  • 国际专利分类:   H01L021/283
  • 专利详细信息:   CN102945801-A 27 Feb 2013 H01L-021/283 201350 Pages: 9 Chinese
  • 申请详细信息:   CN102945801-A CN10476623 22 Nov 2012
  • 优先权号:   CN10476623

▎ 摘  要

NOVELTY - Metal alkoxide is dissolved in organic solvent to obtain metal alkoxide solution having molar concentration of 0.0001-1 mol/L. The metal alkoxide solution is uniformly coated on graphene surface, organic solvent is volatilized and hydrolyzed, to obtain ultra-thin metal hydroxide film which is used as a nucleating layer. The resultant product is provided into a reactor in which atomic layer deposition process is carried out, to obtain graphene high-k gate dielectric layer. USE - Integration method of graphene high-k gate dielectric layer used for semiconductor device e.g. graphene field effect transistor. ADVANTAGE - The method enables integration method of graphene high-k gate dielectric layer with high dielectric constant and quality, and excellent damage resistance.