• 专利标题:   Distributed radiating structure of flat computer main board, has heat equalizing plate that is fixed on outer wall of top portion of heat insulation frame and graphene radiating film fixed on top portion.
  • 专利号:   CN217821505-U
  • 发明人:   HUANG J
  • 专利权人:   BEIHAI PINCHUANG ELECTRONICS CO LTD
  • 国际专利分类:   G06F001/20
  • 专利详细信息:   CN217821505-U 15 Nov 2022 G06F-001/20 202295 Chinese
  • 申请详细信息:   CN217821505-U CN21661249 29 Jun 2022
  • 优先权号:   CN21661249

▎ 摘  要

NOVELTY - The utility model relates to flat computer radiating field, especially relates to a flat computer main board distributed radiating structure, comprising a main board and a chip fixed on the main board, the top part of the outer wall of the chip is provided with a driven copper pipe, and the main board top outer wall located at one side of the driven copper pipe is provided with a radiating structure; the radiating structure comprises a driving copper pipe, a conductive copper pipe connected on the outer wall of the side of the driving copper pipe, a heat insulating frame fixed on the outer wall of the top part of the driving copper pipe, a semiconductor refrigerating sheet installed at the outer wall of the top part of the driving copper pipe and located at the centre of the heat insulating frame, a heat equalizing plate fixed on the outer wall of the top of the heat insulating frame and graphene radiating film fixed on the outer wall of the top of the heat equalizing plate. When the temperature of the utility model is too high, the semiconductor refrigerating sheet will be started, the passive copper pipe, the active copper pipe and the condensing end of the conductive copper pipe are used for absorbing heat, the liquid circulating speed is improved, the radiating efficiency is maintained, the soaking plate and graphene radiating film are used for radiating the semiconductor refrigerating sheet.