▎ 摘　　要

NOVELTY - Preparing copper alloy semiconductor lead frame, comprises (i) heating copper alloy ingots to 960-980℃ for hot rolling treatment, and controlling the final rolling temperature to 735-745℃ to obtain hot rolling copper alloy, (ii) removing oxide skin on the surface of the hot-rolling copper alloy after the milling surface is removed, and aging to obtain copper alloy base material, (iii) adding copper alloy semi-finished product to the silver plating bath for silver-plated plating treatment to obtain silver plated lead-lead frame semi-finishing product, (iv) activating the silver plated lead frame semi-finished product to obtain activated silver plated lead frames semi-finished products, (vii) adding semi-finished product into the graphene dispersion solution for 7-15 minutes, soaking in deionized water, cleaning and drying. USE - The method is useful for preparing copper alloy semiconductor lead frame. ADVANTAGE - The method has good anti-corrosion performance, can effectively ensure the safety of the silver plating layer, strengthens the use performance of the copper alloy semiconductor lead frame, and the residual stress of the lead frame can be effectively reduced by multiple cold rolling aging matching treatments.