• 专利标题:   High heat dissipation stretchable and flexible film used to release heat generated from electronic device i.e. laptops and computers, comprises base layer and heat dissipation layer laminated on surface of base layer.
  • 专利号:   KR2021067594-A, KR2332416-B1
  • 发明人:   LEEILNO
  • 专利权人:   PTOC CO LTD
  • 国际专利分类:   C08J007/04, C09D175/04, C09D175/14, C09D005/18
  • 专利详细信息:   KR2021067594-A 08 Jun 2021 C08J-007/04 202162 Pages: 12
  • 申请详细信息:   KR2021067594-A KR157385 29 Nov 2019
  • 优先权号:   KR157385

▎ 摘  要

NOVELTY - High heat dissipation stretchable and flexible film comprises a base layer (110), and a heat dissipation layer (120) laminated on the surface of the base layer, where the heat dissipation layer is formed by coating a heat dissipation coating composition comprising a thermal interface filler, a photocurable binder resin or a thermosetting binder resin and a solvent on the surface of the base layer. USE - The film is useful to release heat generated from electronic device including laptops and computers. ADVANTAGE - The film has improved thermal conductivity, maximizes heat dissipation characteristics, dissipates heat generated from heat source not only in plane direction but also in thickness direction of device; prevents malfunction of peripheral devices and deterioration of substrate; controls emitted heat which is urgently required, and is economical. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the high heat dissipation stretchable and flexible film. Adhesive sheet (100) Base layer (110) Heat dissipation layer (120) Protective layer (130) Adhesive layer (140)