▎ 摘　　要

NOVELTY - Transfer process for preparing low-dimensional material stack structure, comprises e.g. (i) placing upper and lower carriers directly opposite each other, marking upper carrier as carrier A, and marking lower carrier as carrier B; placing sample on carrier B, and directly locating carrier A above sample without touching it; dropping adsorption solution on sample, and moving carrier A or carrier B to make the sample contact and adhere to carrier A; completely naturally volatilizing adsorption solution, dropping jacking solution between the carrier A and the carrier B; during the natural evaporation of jacking solution, separating carrier A and carrier B when the sample can be separated from carrier B, at this time, sample is attached to the carrier A; and (ii) taking another sample and placing it on carrier B, directly locating carrier A above sample on carrier B without touching it; moving carrier A or carrier B so that the sample on carrier A contacts and fits the sample on carrier B. USE - The material stack structure is useful for functional material and functional device. ADVANTAGE - The stacked material: has no composition transition, and formed heterojunction has atomic-level steep carrier (potential field) gradient; and has strong grid response capability and flexible substrate. DETAILED DESCRIPTION - Transfer process for preparing low-dimensional material stack structure, comprises (i) placing the upper and lower carriers directly opposite each other, marking upper carrier as carrier A, and marking lower carrier as carrier B; placing the sample on the carrier B, and directly locating carrier A above sample without touching it; dropping the adsorption solution on the sample, and moving the carrier A or carrier B to make the sample contact and adhere to the carrier A; completely naturally volatilizing adsorption solution, dropping the jacking solution between the carrier A and the carrier B; during the natural evaporation of jacking solution, separating carrier A and carrier B when the sample can be separated from carrier B, at this time, sample is attached to the carrier A; and (ii) taking another sample and placing it on carrier B, directly locating carrier A above sample on carrier B without touching it; moving carrier A or carrier B so that the sample on carrier A contacts and fits the sample on carrier B; dropping the stripping solution between carrier A and carrier B, during the natural evaporation of stripping solution, when the sample on carrier A can be separated from carrier A, moving carrier A or carrier B to separate the two carriers, obtaining stacked structure material on carrier B