▎ 摘　　要

NOVELTY - An electronic device comprises an electronic component (210), a heat sink (55) arranged on the electronic component, where the surface of the heat sink is provided with a magnetic layer (231) containing a permanent magnetic material, and a composite thermal-conductive material (100) which is incorporated between the electronic component and heat sink. The composite thermal-conducting material includes an organic matrix, and thermal-conducting filler distributed in the organic matrix. The thermal-conducting filler includes ferromagnetic particles. USE - Electronic device such as chip e.g. bare chip and ball grid array packaged chip. ADVANTAGE - The electronic device has reduced heat resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the composite thermal-conducting material, which comprises an organic matrix, thermal-conductive filler distributed in the organic matrix and including ferromagnetic particles and non-magnetic particles including large-diameter particles having an average particle diameter larger than the average particle diameter of the ferromagnetic particles. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the electronic device. 51Circuit board 55Heat sink 100Composite thermal-conductive material 210Electronic component 231Magnetic layer 233Coating