• 专利标题:   Preparation of graphene copper-based reinforced thermal conductive film involves pre-treating foamed copper powder, chemically depositing with graphene, mixing with foamed graphene powder, and adding graphene/pure copper mixed powder.
  • 专利号:   CN113172211-A
  • 发明人:   JIA T, HONG W, ZHOU R, XI X, YANG F, LI M
  • 专利权人:   SHENZHEN HEIJIN IND MFG CO LTD
  • 国际专利分类:   B22D019/00, B22D027/08, B22F009/04, C23C014/16, C23C014/24, C23C016/26, C23C016/44
  • 专利详细信息:   CN113172211-A 27 Jul 2021 B22D-019/00 202177 Pages: 11 Chinese
  • 申请详细信息:   CN113172211-A CN10395220 13 Apr 2021
  • 优先权号:   CN10395220

▎ 摘  要

NOVELTY - A graphene copper-based reinforced thermal conductive film is prepared by taking foamed copper powder, pre-treating, chemically depositing with graphene to obtain graphene composite foamed copper powder, mixing with foamed graphene powder, adding graphene/pure copper mixed powder, ball milling, vapor-depositing with copper, mixing, spreading onto flat mold bottom, covering upper surface with copper foil, casting copper liquid under oscillating conditions, and lowering temperature by program under the conditions of vacuum oscillation. USE - The method for preparing graphene copper-based reinforced thermal conductive film. ADVANTAGE - The method does not involve electroplating process, has low energy consumption, is environment-friendly, relatively stable heat conducting film structure, high strength, excellent mechanical property, high film size controllability, and the size is increased, mechanical and electrical performance is stable, and is suitable for each field.