• 专利标题:   Method of etching atomic layer of graphene used for semiconductor device, involves adsorbing reactive radical to surface of graphene, and irradiating energy source to graphene to which reactive radical is adsorbed.
  • 专利号:   WO2013015559-A2, KR2013011922-A, WO2013015559-A3, KR1380835-B1, US2014206192-A1, US9245752-B2
  • 发明人:   YEOM G Y, LIM W S, MIN K S, KIM Y Y, OH J S
  • 专利权人:   UNIV SUNGKYUNKWAN RES BUSINESS FOUND, UNIV SUNGKYUNKWAN RES BUSINESS FOUND, UNIV SUNGKYUNKWAN RES BUSINESS FOUND, UNIV SUNGKYUNKWAN RES BUSINESS FOUND
  • 国际专利分类:   B01J019/08, C01B031/02, H01L021/3065, B01J019/12, H01L021/04, H01L021/302, H01L029/16, H01L029/66
  • 专利详细信息:   WO2013015559-A2 31 Jan 2013 C01B-031/02 201312 Pages: 29
  • 申请详细信息:   WO2013015559-A2 WOKR005747 19 Jul 2012
  • 优先权号:   KR072843, KR074309

▎ 摘  要

NOVELTY - Method of etching atomic layer of graphene involves adsorbing reactive radical to a surface of graphene, and irradiating energy source to graphene to which the reactive radical is adsorbed. USE - Method of etching atomic layer of graphene used for semiconductor device. ADVANTAGE - The method efficiently and economically provides etched graphene with suppressed generation of damage to reaction chamber, without affecting the environment. The etch depth of graphene is controlled selectively by simple method while graphene etching is controlled to atomic unit.