▎ 摘　　要

NOVELTY - Graphene composite glue, comprises 100-120 pts. wt. modified epoxy resin, 10-15 pts. wt. curing agent, 5-7 pts. wt. curing accelerator, 5-7 pts. wt. heat retardant, 40-50 pts. wt. organic solvent and 20-30 pts. wt. composite filler. USE - The graphene composite glue is useful for copper-clad aluminum substrate with high thermal conductivity (claimed). ADVANTAGE - The glue: ensure the excellent heat-conducting performance, mechanical property, corrosion resistance, dielectric loss, and high pressure resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing a graphene composite glue solution, comprising (i) dispersing silicon nitride into absolute ethyl alcohol, adding deionized water and a silane coupling agent, uniformly stirring and performing ultrasonic treatment to obtain a dispersion liquid, heating and reacting to 70-75℃, preserving heat, aging, cooling to room temperature, filtering, washing and drying to obtain pretreated silicon nitride, where the first and second end of the pipe are connected with each other, adding graphene oxide into deionized water, performing ultrasonic dispersion and nitrogen displacement, adding ethylenediamine disuccinic acid, stirring, heating to 90-105℃, reacting, cooling to room temperature, centrifuging to obtain a solid phase component, washing with deionized water and performing vacuum drying to obtain pretreated graphene oxide, dispersing the prepared pretreated silicon nitride and pretreated graphene oxide into an N, N-dimethylformamide solvent, heating to 110-125℃, stirring for reaction, vacuumizing, heating to 115-125℃, preserving heat, aging, naturally cooling, filtering, washing with water and drying to obtain a composite filler, (ii) adding bisphenol A and ethylene glycol in a nitrogen atmosphere, heating to 60-70℃, completely melting the bisphenol A, adding solid potassium hydroxide, uniformly stirring, dropwise adding epoxy chloro propane accounting for 70 wt.% of the total mass, reacting, hermetically adding ferric p-toluenesulfonate and 3, 4-ethylenedioxythiophene, dropwise adding the rest 30 wt.% of the total amount of epoxy chloro propane, continuously reacting for 1-2 hours, heating to 90-100℃, preserving heat, aging, removing unreacted epoxy chloro propane in vacuum to obtain a reaction solution, washing the reaction solution to be neutral and distilling under reduced pressure to remove ethylene glycol to obtain modified epoxy resin, (iii) dissolving a curing agent and a curing accelerator in an organic solvent, stirring until the curing agent and curing accelerator are completely dissolved, adding the modified epoxy resin prepared in the resultant step, composite filler prepared in the step (i) and a flame retardant, uniformly stirring and curing for 4-6 hours to obtain product.