▎ 摘　　要

NOVELTY - The method involves mixing the red light fluorescent powder ceramic raw material and the green light fluorescent powder ceramic raw material according to the weight ratio of 1: 1 according to the principle that red light and green light can be excited by blue light. The raw materials are pressed into a flaky substrate, sintered at high temperature, and polished after sintering. A two-dimensional material structure is prepared, a sheet-shaped substrate is polished,a graphene or boron nitride two-dimensional material thin-layer nucleation layer is prepared on the substrate, and the substrate is finally put into an metal organic chemical vapor deposition (MOCVD)reaction chamber to grow the traditional LED epitaxial structure. The process treatment is carried out, the chip is cooled and taken after growth is finished, and chip process preparation is carried out. The chip directly emitting white light is obtained after electric injection after the process is finished. USE - Method for preparing white light LED epitaxial material without packaging used in LED chip preparation application technology field. ADVANTAGE - The method enables to prepare white light LED epitaxial material without packaging. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of the method for preparing white light LED epitaxial material without packaging. (Drawing includes non-English language text).