• 专利标题:   LED filament, has multiple LED chips mounted and fixed on substrate in array, and fluorescent glue layer located on upper and lower parts of substrate, where surface of fluorescent glue layer is covered with graphene adhesive layer.
  • 专利号:   CN214012966-U
  • 发明人:   YAN Q, ZHENG Z, MA L
  • 专利权人:   ANHUI HANGKE SEMICONDUCTOR TECHNOLOGY CO LTD
  • 国际专利分类:   H01L033/64, H01L033/56, H01L025/075
  • 专利详细信息:   CN214012966-U 20 Aug 2021 H01L-033/64 202178 Pages: 7 Chinese
  • 申请详细信息:   CN214012966-U CN22727671 23 Nov 2020
  • 优先权号:   CN22727671

▎ 摘  要

NOVELTY - The utility model claims an LED filament, comprising: a substrate; a plurality of LED chips; a fluorescent glue layer; a graphene adhesive layer; wherein the plurality of LED chips are mounted and fixed on the substrate in an array; the LED chips are connected in series, in parallel or in series and in parallel; the fluorescent glue layer is located on the upper and lower surfaces of the substrate; the surface of the fluorescent glue layer is covered with the graphene glue layer; the LED filament is provided with a graphene glue layer; the graphene rubber layer is set on the outer surface of the fluorescent glue layer, so that the LED filament has better radiating effect; the service life of the filament is improved; the graphene rubber layer can coat the outer surface of the filament to form beautiful and consistent appearance colour according to the requirement.