▎ 摘　　要

NOVELTY - The method involves performing laser etching to punch a hole in a graphene, and a through hole is evenly distributed to obtain a holed graphite. The surface metallization is performed from top to bottom of silver-based solder, perforated graphene, silver-based solder and copper foil assembly according to copper foil, and then vacuum brazing to obtain metallized graphene. The metallized graphene is embedded in a frame, and assembled from top to bottom according to aluminum plate, tin-based solder, metallized graphene, tin-based solder, and aluminum plate, and then vacuum brazed to obtain a sandwich. USE - Method for packaging sandwich type graphene heat dissipation plate. ADVANTAGE - The room temperature shear strength of the joint between the metallized graphene and the aluminum plate after graphene encapsulation reaches 7 MPa or more.