▎ 摘　　要

NOVELTY - Creating thermal interface involves providing a template having multiple pores, depositing a metal seed layer on one surface of the template, forming multiple nanowires within the pores of the template to a height approximately even with a surface of the template opposite the metal seed layer for forming a nanowire array. The template is subjected to etching to release multiple nanowires. The nanowires are each coated with graphene and a top metal layer is deposited on the nanowire array. USE - Method for creating thermal interface. ADVANTAGE - The thermal interface created increases power density, and thermal resistance of interfaces, which is widely identified as a bottleneck in the thermal management of electronics, where constitute more than 50% of the total thermal resistance from device to cooling fluid. The thermal interface materials reduces thermal contact resistance by filling up interfacial gaps and dissipating heat, thus increases device life-time and reliability, and resolves the problems of mismatches in the coefficients of thermal expansion between two jointed materials, which can cause delamination and device failure. The thermal interface also enables electronic systems, ranging from microelectronics to portable electronics to massive data centers, to operate at lower temperatures, or at the same temperature but with higher performance and higher power density. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for bonding a thermal interface created by the thermal interface between first substrate and second substrate, which involves: (1) placing the thermal interface between the first substrate and the second substrate; (2) heating the thermal interface to a temperature above the melting point of solder; and (3) compressing the first and the second substrates together such that the first solder layer and second solder layer bond the thermal interface to the first and second substrates respectively.