• 专利标题:   Heat conducting composite material, useful in thermal garment, solar microwave water purifier, infrared paint or LED, comprises a matrix, and many graphene sheets respectively having two-dimensional planar structure.
  • 专利号:   US2014131757-A1, CN103811651-A, TW201418441-A, TW460265-B1, US9404028-B2
  • 发明人:   LIN H, LIN I, LIN Y, SONG J, SUNG C, SUNG C M, LIN I C
  • 专利权人:   RITEDIA CORP, LAIZUAN CO LTD, RITEDIA CORP
  • 国际专利分类:   C09K005/14, H01L033/64, B82Y030/00, C02F001/30, C09D005/00, C09D007/12, A41D013/015, B01J019/08, B82Y010/00, C02F001/02, H01L027/15, H01L029/267, H01L031/0203, H01L031/12, H01L033/00
  • 专利详细信息:   US2014131757-A1 15 May 2014 C09K-005/14 201437 Pages: 8 English
  • 申请详细信息:   US2014131757-A1 US075921 08 Nov 2013
  • 优先权号:   TW142006

▎ 摘  要

NOVELTY - Heat conducting composite material comprises: a matrix; and many graphene sheets respectively having a two-dimensional planar structure, where a basal plane of each of the graphene sheets has a lateral size of 0.1-100 nm, and comprises a quantum well structure. USE - The heat conducting composite material is useful in a thermal garment, a solar microwave water purifier, an infrared paint and LED (all claimed). ADVANTAGE - The heat conducting composite material: provides high radiating efficiency and heat dissipation effect without affecting the light extraction rate of LED; utilizes the graphene sheets having a high degree of graphitization; and provides the infrared paint material exhibiting improved thermal storage or high temperature resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an LED comprising: an insulating substrate (11); a chip (12) disposed on the insulating substrate; a conducting wire frame clamped between the insulating substrate and the chip; a conducting wire (14) having one end connected to the chip, and one other end connected to the wire conducting frame; and a transparent package material (15) as the heat conducting composite material covering on the insulating substrate. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of the LED. Insulating substrate (11) Chip (12) Conducting wire frame (13) Conducting wire (14) Transparent package material (15)