• 专利标题:   Graphite heat dissipation paste electronic device, has locating glue layer adhered on inner surface of metal heat conducting layer, and graphene heat dissipation layer for radiating heat in environment of outer side of electronic device.
  • 专利号:   CN210275002-U
  • 发明人:   LIN S
  • 专利权人:   LIN S
  • 国际专利分类:   G06F001/20, H05K007/20
  • 专利详细信息:   CN210275002-U 07 Apr 2020 H05K-007/20 202032 Pages: 7 Chinese
  • 申请详细信息:   CN210275002-U CN21189162 26 Jul 2019
  • 优先权号:   CN21189162

▎ 摘  要

NOVELTY - The utility model claims a graphite heat dissipation paste for electronic device, relating to the electronic product field of heat dissipating technology, solves the problem that the graphene radiating patch technology problem that heat dissipation efficiency is relatively low. the electronic device graphene radiating patch comprising a graphite heat dissipation layer, metal conducting layer and a locating glue, wherein the graphite heat dissipation paste is graphite heat dissipation layer in turn from outside to inside, a metal conducting layer and the positioning layer, graphene radiating layer is covered on the outer surface of the metal conducting layer. locating glue layer is adhered on the inner surface of metal heat-conducting layer, graphene radiating patch by positioning adhesive layer adhered on the heating source and covers the plane of the electronic device component, a locating glue layer and a metal heat-conducting layer is capable of absorbing the heat of the heating source and conducted to the graphite heat dissipation layer. graphite heat dissipation layer can radiates the heat in the environment outside the electronic device. The utility model is used for improving the prior art electronic device graphene heat dissipation of the heat dissipation efficiency.