• 专利标题:   Photon device for high-speed interconnection in light sub-system, has multiple metal layers set on substrate, photon material layer provided with graphene and set on multiple metal layers, and light routing layer provided with waveguide and set on photon material layer.
  • 专利号:   CN113885127-A, US2022066099-A1, TW202229950-A, US11550102-B2, US2023114059-A1
  • 发明人:   ISLAM R, RUSU S, SONG W, ISLAM M R
  • 专利权人:   TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MFG CO LTD, TAIWAN SEMICONDUCTOR MFG CO LTD
  • 国际专利分类:   G02B006/12, G02B006/122, G02B006/13, G02F001/01, G02F001/035, G02B006/132, G02B006/136, H04B010/25, C01B032/182, C01B032/184
  • 专利详细信息:   CN113885127-A 04 Jan 2022 G02B-006/12 202215 Chinese
  • 申请详细信息:   CN113885127-A CN10756144 05 Jul 2021
  • 优先权号:   US007743, US080684

▎ 摘  要

NOVELTY - Device comprises multiple metal layers set on a substrate. A photon material layer is provided with a graphene and is set on multiple metal layers. A light routing layer is provided with a waveguide and is set on the photon material layer. USE - Photon device for high-speed interconnection in light sub-system. ADVANTAGE - The device provides high-speed interconnection in light sub-system. The device allows the waveguides to be formed on the substrate, so that the device can be fabricated in a simple and cost efficient manner. The light routing layer can be formed in an easy manner, thus reducing the manufacturing cost of the device. The waveguide is formed on a top surface of the waveguide, so as to reduce the thickness of the light routing material, thus improving the light-to-electrical conversion efficiency of the photonic device in an efficient manner, and hence improving the performance of the optical communication system in a cost-efficient manner, while reducing the size and weight of the system, and improving the reliability of the electrical to optical converter and the optical to electrical converter in an efficient manner.