• 专利标题:   Graphene substrate used as wiring material, consists of substrate, graphene in which through-hole is laminated on substrate and penetrated in thickness direction, and fixing portion for fixing graphene to surface of substrate.
  • 专利号:   JP2018181863-A
  • 发明人:   NARUTSUKA S, YAMADA J
  • 专利权人:   UNIV MEIJO
  • 国际专利分类:   H01L021/3205, C01B032/184, H01L021/285, H01L021/768, H01L023/532
  • 专利详细信息:   JP2018181863-A 15 Nov 2018 H01L-021/3205 201879 Pages: 29 Japanese
  • 申请详细信息:   JP2018181863-A JP073383 03 Apr 2017
  • 优先权号:   JP073383

▎ 摘  要

NOVELTY - A graphene substrate consists of a substrate (10), a graphene (11A) in which a through-hole (11B,13B,14) is laminated on the surface side of substrate and penetrated in the thickness direction, and a fixing portion (11C) for fixing the graphene to the surface of substrate provided in the through-hole. USE - Graphene substrate is used as wiring material for electronic device. ADVANTAGE - The graphene substrate has excellent fixing property of graphene with respect to substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of graphene substrate, which involves laminating successively a carbon layer (11) containing carbon in the surface side of the substrate, and a metal layer (12) containing a metal (a1) which is a catalyst metal utilized for formation of graphene, laminating a metal layer (13) containing a metal (a2) which does not deposit carbon to the surface side of layer (12), patterning the through-hole penetrated to the layer (12) and the layer (13) at the thickness direction, dissolving the carbon layer provided between the substrate and the layer (12), patterning graphene having the shape of through-hole by the layer (12) and the layer (13), forming the fixing portion which leaves the carbon layer and fixing the graphene to the surface of substrate in the through-hole of graphene, and removing the layer (12) and the layer (13). DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view explaining manufacture of graphene substrate. Substrate (10) Carbon layer (11) Graphene (11A) Through-holes (11B,13B,14) Fixing portion (11C) Metal layers (12,13)