• 专利标题:   Growing two-dimensional transition metal chalcogenide film for manufacturing e.g. diode, involves placing patterned metal layer on substrate surface, supplying chalcogen precursor and transition metal precursor to chamber, and evacuating.
  • 专利号:   US2021388488-A1, KR2021155694-A
  • 发明人:   LEE E, AHN W, KIM H, LEE H, LEE H S, KIM H S, AHN W S, HA L
  • 专利权人:   UNIV SUNGKYUNKWAN RES BUSINESS FOUND, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, UNIV SUNGKYUNKWAN RES BUSINESS FOUND
  • 国际专利分类:   C23C016/02, C23C016/30, C23C016/455, H01L021/02, H01L021/285
  • 专利详细信息:   US2021388488-A1 16 Dec 2021 C23C-016/30 202215 English
  • 申请详细信息:   US2021388488-A1 US132111 23 Dec 2020
  • 优先权号:   KR073246

▎ 摘  要

NOVELTY - Growing a two-dimensional transition metal chalcogenide (TMC) film, involves placing a patterned metal layer on the surface of a substrate, supplying a chalcogen precursor to a reaction chamber with the substrate, supplying 0.1-2 μg a transition metal precursor to the reaction chamber and evacuating the chalcogen precursor, transition metal precursor and by-products generated from the reaction chamber. USE - Method for growing two-dimensional transition metal chalcogenide film that is utilized for manufacturing a device such as transistor, diode, optoelectronic device, tunneling device, logic device and memory device (all claimed). ADVANTAGE - The method enables cost-effective growing of two-dimensional TMC film with secured uniformity and high quality, on a wafer scale by simultaneously performing deposition and etching of two-dimensional TMC film, by controlling supply time of transition metal precursor and by controlling a deposition rate of two-dimensional TMC film. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included a method for manufacturing a device containing two-dimensional transition metal chalcogenide (TMC) film, which involves: a. growing the two-dimensional TMC film on a substrate; b. forming an electrode on the two-dimensional TMC film.