▎ 摘　　要

NOVELTY - The insulating substrate comprises an inner metal layer (110,210) configured to face the semiconductor chip, an outer metal layer (120,220) configured to face the cooler, and an insulating layer (130,230) interposed between the inner metal layer and the outer metal layer. The inner thermal diffusion inductor of multiple inner thermal diffusion inductors is inserted into the inner metal layer. USE - Insulating substrate for dual-side cooled power module (claimed). ADVANTAGE - The insulating substrate is capable of securing a path for diffusing heat generated from a semiconductor chip to improve heat dissipation efficiency. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a dual-side cooled power module. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an insulating substrate. Spacer (30) Semiconductor chip (40) Inner metal layer (110,210) Outer metal layer (120,220) Insulating layer (130,230)